pecial-Purpose Water Cooling Plates (Special Liquid Cooling Plates)

I. Core Definition & Technical Positioning

• Nature: Metal baseplates (aluminum/copper/alloy) with integrated precision internal flow channels, enabling forced heat exchange via circulating coolant.
• Special Characteristics: Non-standardized, highly customized, focusing on five key dimensions: high heat flux, high precision, high reliability, extreme environments, and special-shaped structures.
• Core Indicators: Thermal resistance ≤ 0.05℃/W, pressure resistance ≥ 8bar, temperature difference ≤ ±3℃, suitable for heat flux at 100~1000W/cm² level.

II. Main Types & Technical Features (By Application Scenario)

1. Micro-Channel Liquid Cooling Plates (MLCP) – King of High Heat Flux

• Structure: Embedded micron-scale flow channel network of 0.05~1mm, with channel density up to hundreds per cm².
• Advantages: Thermal resistance as low as 0.015℃/W, heat dissipation efficiency 3~5 times that of traditional designs.
• Process: Photolithography etching, precision brazing, 3D printing.
• Applications: AI chips (GPU/TPU), laser devices, SiC power modules.

2. Special-Shaped / Integrated Water Cooling Plates – Ultimate Space Adaptation

• Structure: Conformal curved surfaces, integrated multi-hole design, dual function as structural component and heat sink.
• Process: Friction Stir Welding (FSW), die-casting, CNC milling.
• Advantages: No splicing, excellent airtightness, lightweight.
• Applications: Power battery packs, motor housings, aerospace avionics.

3. Extreme Environment Resistant Water Cooling Plates – For Military & Marine Use

• Characteristics: High/low temperature resistance (-55℃~250℃), salt spray resistance (1000h+), vibration resistance (5~500Hz/5Grms).
• Materials: Titanium alloy, stainless steel, anti-corrosion coating.
• Applications: Shipboard electronics, radar, metallurgical equipment, polar scientific research devices.

4. Nanofluid / Two-Phase Flow Water Cooling Plates – Ultra-High Efficiency Heat Dissipation

• Technology: Coolant doped with nanoparticles (Cu/Al₂O₃) or phase-change working fluid (fluorocarbon fluid).
• Performance: Thermal conductivity increased by 2~3 times, heat dissipation capacity doubled.
• Applications: MRI, supercomputers, high-power lasers.

5. Flexible / Ultra-Thin Water Cooling Plates – For Wearable & Precision Medical Devices

• Structure: Fabric-embedded micro-flow channels, thin-film metal (thickness < 1mm).
• Characteristics: Bendable, ultra-thin, silent.
• Applications: VR/AR headsets, medical implants, flexible screens.

III. Core Manufacturing Processes (Special Processes)

• Friction Stir Welding (FSW): Solder-free, high strength, excellent airtightness, suitable for large-size and high-pressure conditions.
• Vacuum Brazing: Smooth flow channels, low thermal resistance, ideal for micro-channels and complex structures.
• 3D Printing (SLM): Topologically optimized flow channels with 30% higher efficiency, used for customized aerospace parts.
• Skiving / Etching: High-density fins for maximum heat exchange area, applied to AI chip cold plates.

IV. Typical Application Scenarios (Special Fields)

• AI & Supercomputing: Direct contact cooling for GPU training clusters, suppressing hot spots and ensuring full-frequency operation.
• New Energy Vehicles: 800V electric drives, silicon carbide modules, flash-charging battery thermal management.
• Medical Equipment: MRI gradient amplifiers, CT detectors, with temperature control accuracy of ±0.5℃.
• Lasers & Optoelectronics: High-power fiber/semiconductor lasers, stabilizing wavelength and output power.
• Military & Aerospace: Radar, missile guidance systems, satellite payloads, featuring vibration resistance, radiation resistance and lightweight design.
• Special Industry: Metallurgy, wind power converters, energy storage converters, dust and oil resistant.

V. Core Differences from Standard Water Cooling Plates

VI. Summary