• Liquid Cooling Plate with Modular Assembly and Shared Copper Manifold for Simplified Installation and Water Distribution
Liquid Cooling Plate with Modular Assembly and Shared Copper Manifold for Simplified Installation and Water Distribution

Liquid Cooling Plate with Modular Assembly and Shared Copper Manifold for Simplified Installation and Water Distribution

Product Details:

Place of Origin: Dongguan,Guangdong,China
Brand Name: UCHI
Certification: UL.VDE,SGS,REACH,CQC,CSA.ISO.ROHS,CUL

Payment & Shipping Terms:

Minimum Order Quantity: 1000PCS
Price: Negotiable
Packaging Details: Bulk
Delivery Time: 5-7 days
Payment Terms: T/T,Paypal,Western Union,
Supply Ability: 5000,000,000PCS Per Month
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Detail Information

Width: According To Customer Demand Coolant Type: Silicone Oil
Surface Flatness: Below 0.005 Cm/cm Thermalconductivity: 400 W/m·K (Copper)
Body Material: Aluminum Dimension: 125x110x18 Mm
Heat Conducting Power: 30W Thermal Dissipation Power: 2000W
Heat Cooling Power: 45W Input Current: ≤10A
Coolingmethod: Liquid Cooling Outletdiameter: G1/4 Inch Standard
Fluid: Water Or Suitable Coolant Process: Brazed Skived Fin
Service: OEM Custom Service
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Product Description

B300 GPU Integrated Liquid Cooling Module

Product Overview

 
This is a pre-assembled direct liquid cooling cold plate assembly for NVIDIA B300 SXM GPU. It adopts a full copper manifold integrated design, connecting multiple GPU cold plates via high-temperature resistant flexible hoses. It is specially developed for AI server air-to-liquid retrofitting and new liquid-cooled machine deployment. It effectively solves the high heat dissipation challenge of B300 high-power GPUs, eliminates hot spots, prevents thermal throttling, and supports stable 7×24-hour continuous full-load operation for large model training and inference clusters.
 

Key Advantages

 
✅ High Conductivity Pure Copper Structure
 
The manifold and cold plate body are made of high-purity oxygen-free copper, with excellent thermal conductivity. The internal fine flow channel is optimized by CFD thermal simulation, achieving ultra-low thermal resistance and uniform temperature distribution for each GPU core and HBM memory.
 
✅ Centralized Manifold Integrated Design
 
Adopts a shared copper manifold for water distribution and collection. The flow rate of each cold plate is evenly distributed, the overall pressure drop is low, and it is well matched with the CDU liquid cooling distribution unit of the data center. The modular assembly greatly simplifies on-site installation and pipeline arrangement.
 
✅ Reliable Vacuum Brazing Sealing
 
All cold plates and manifold joints are formed by one-time vacuum brazing. Each finished product undergoes strict pressure holding and leak detection testing before delivery to ensure zero leakage risk and meet the strict safety standards of IDC intelligent computing centers.
 
✅ Matching Original Server Installation Dimensions
 
The positioning holes, pressure plate and fastening structure are completely compatible with the original B300 server. No cutting or modification to the server chassis is required, which is convenient for batch air-cooling to liquid-cooling transformation of existing computing nodes.
 
✅ Wide Compatibility of Coolant
 
Compatible with deionized water, PG25 / PG30 environmental protection coolant. The reinforced rubber hoses have good resistance to aging, hydrolysis and pressure, adapting to long-term uninterrupted operation scenarios of computing clusters and reducing the overall PUE of the computer room.
 

Specifications & Construction

 
  • Compatible Chip: NVIDIA B300 SXM GPU
  • Structure Form: Integrated copper manifold + multiple GPU cold plates, pre-connected with hoses
  • Main Material: High-purity oxygen-free copper
  • Hose: High-pressure & high-temperature resistant reinforced liquid cooling hose
  • Processing Technology: Vacuum brazing integrated molding
  • Testing Standard: Pressure holding leak test, anti-leakage certification
  • Customization Support: Manifold interface specification, hose length, flow channel scheme, inlet and outlet direction can be customized according to server structure

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