Two sets of pure copper microchannel heat exchange regions with fine grooves can be seen on the left and right, corresponding to two heat-generating chips (such as dual GPUs, dual RF chips, or dual laser bars). An isolation trench is reserved in the middle to realize zoned heat dissipation for heat sources, which can match different chip power consumption individually.

The fine parallel lines on the surface are micrometer-scale microchannels. Coolant flows through these tiny grooves to greatly expand the heat exchange area and carry away heat of high heat flux density.

The main body is made of high-purity pure copper, with a metal sealing base on the periphery. Vacuum brazing is adopted to hermetically join the microchannel copper sheet and baseplate for pressure resistance and leak prevention. The contact surface is precision machined to ensure close contact with chips and reduce contact thermal resistance.

Conventional single-piece microchannel cold plates are designed for a single heat source. This dual-heat-source integrated cold plate dissipates heat for two chips simultaneously. The flow paths can be designed as parallel or series water circuits, compatible with multi-chip modules and saving assembly space.

This pure copper dual-zone microchannel liquid cold plate is precision-machined from high-purity copper with a zoned micrometer-scale microchannel structure. One single cold plate serves two heat-generating chips at the same time. Integrated sealing by vacuum brazing delivers stable pressure resistance for the water circuit and eliminates leakage. The working surface is precision ground to ensure tight bonding with chips and reduce interfacial thermal resistance. The flow channel density and water circuit scheme can be customized according to the power difference between the two chips to optimize temperature uniformity. Customization of outline dimensions, inlet/outlet positions and mounting holes is supported to meet liquid cooling requirements of high-power multi-chip modules.

✅ Dual-heat-source zoned cooling: One cold plate cools two chips concurrently, optimizes module temperature uniformity and saves overall system space ✅ Enhanced heat transfer by pure copper microchannels: Dense micrometer-scale flow channels provide large heat exchange area and support ultra-high heat flux density ✅ Vacuum brazing sealing: Robust weld seams with high pressure resistance; no risk of water leakage during long-term cyclic operation ✅ Customizable differentiated flow channels: Separate channel design available for chips with different power consumption to achieve more balanced temperature control ✅ Low contact thermal resistance working surface: Precision planar machining for excellent chip fitting ✅ Wide compatibility: AI multi-chip modules, laser arrays, RF power amplifiers, radar assemblies and high-power semiconductor modules