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Copper Microchannel Liquid Cold Plate, High-Power Chip Water Cooling Heat Sink
Product Details:
| Place of Origin: | Dongguan，Guangdong,China |
| Brand Name: | UCHI |
| Certification: | UL.VDE,SGS,REACH,CQC,CSA.ISO.ROHS,CUL |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1000PCS |
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| Price: | Negotiable |
| Packaging Details: | Bulk |
| Delivery Time: | 5-7 days |
| Payment Terms: | T/T,Paypal,Western Union, |
| Supply Ability: | 5000,000,000PCS Per Month |
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Detail Information |
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| Cone Pipe Thread: | ZG, G, NPT, Etc | Usage: | Electronics |
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| Tolerance: | 0.05 Mm | Cooling Method: | Liquid Cooling With Coolant Flow |
| Protection Class: | IP54 | Precision: | ±0.002 ~ ±0.005mm |
| Conducting Power: | 2000 W | Heat Dissipation Capacity: | 1400W |
| Feature: | High And New In Technology | Application: | RGB Laser Light Source |
| Channel Width: | < 0.3mm | Surfacefinish: | Nickel-plated / Anodized |
| Surface Treatment: | Passivation | Input Voltage: | 24V DC |
| Thickness: | 0.5mm | ||
| Highlight: | Copper microchannel liquid cold plate,High-power chip water cooling,Liquid cooling plate heat sink |
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Product Description
Product Name: Pure Copper Microchannel Liquid Cold Plate, Water Cooling Heat Sink for High-Power Chips
Product Description
This microchannel cold plate is precision-machined from high-purity pure copper. Its interior features densely arranged micrometer-scale microchannels, which greatly expand the heat exchange area and efficiently remove heat generated by chips with high heat flux density. The whole assembly adopts vacuum brazing for integrated sealing. The flow path delivers pressure resistance and leakage prevention, with a flat contact surface. It fits heat sources such as AI chips, GPUs, lasers and RF power devices, and achieves efficient liquid cooling with circulating coolant.
The pure copper substrate boasts outstanding thermal conductivity. The microchannel structure enhances fluid turbulence, bringing substantially improved heat exchange efficiency compared with conventional water cold plates. Customization of outline dimensions, flow path structures and inlet/outlet positions is available to meet heat dissipation requirements across multiple scenarios including server computing modules, radars, high-power power supplies and semiconductor equipment. It serves as a core liquid cooling solution for ultra-high power consumption components.
Key Selling Points
✅ Ultra-high heat exchange efficiency: Micrometer-scale dense microchannel design enlarges heat exchange area and withstands ultra-high heat flux density, resolving thermal bottlenecks of high-power chips.
✅ Pure copper substrate: High-purity copper with high thermal conductivity enables rapid heat transfer and lower thermal resistance.
✅ Precision brazing sealing: Integrated forming via vacuum brazing ensures robust weld seams, pressure resistance, leakage protection and stable long-term operation.
✅ Customizable: Supports custom dimensions, flow patterns, connectors and mounting holes for on-demand development.
✅ Low-thermal-resistance flat contact surface: Precision-ground working surface fits heat sources tightly to reduce contact thermal resistance.
✅ Wide application range: Compatible with GPUs in AI servers, lasers, RF power amplifiers, radar T/R modules and high-power semiconductor modules.
Appearance & Structure
Material: The main body is made of pure copper, which has an extremely high thermal conductivity and is suitable for heat dissipation under high heat flux density.
Fine surface patterns: The fine concentric or radial micro grooves visible in the image are micrometer-scale microchannels. The channel width is typically only tens to hundreds of micrometers, greatly expanding the heat exchange area. Coolant (such as deionized water) flows inside these tiny channels to carry away heat.
Frame: The outer perimeter is a metallic sealing frame, generally sealed by brazing to prevent coolant leakage. Mounting holes are reserved to attach and press the cold plate tightly onto the surface of heat-generating chips (GPUs, AI chips, lasers, radar T/R modules, etc.).
Working Principle
The cold plate is closely attached to the heat-generating chip. Heat transfers rapidly to the copper substrate. Circulating coolant flows through the internal microchannels and efficiently removes heat as it passes through the dense tiny passages. Compared with conventional water cold plates, it delivers far stronger heat exchange capacity and can handle ultra-high heat flux density.
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