• Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator
  • Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator
  • Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator
  • Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator
  • Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator
Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator

Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator

Product Details:

Place of Origin: Dongguan,Guangdong,China
Brand Name: Uchi
Certification: SMC
Model Number: Heat Sink

Payment & Shipping Terms:

Minimum Order Quantity: 100pcs
Price: Negotiable
Payment Terms: T/T,paypal, Western Union,MoneyGram
Supply Ability: 50000000pcs per Month
Get Best Price Contact Now

Detail Information

Heat Conducting Power: 105W Fan Life: 50000 Hrs
Material: Aluminum + Copper Size: 88x68x40mm
Weight: 0.25 Kg Certification: ISO9001:2015 ISO9001:14001
Surface Treatment: Passivation Feature: New Technology And High Efficient Cooling
Highlight:

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high-efficiency buckle radiator

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soldered liquid cooling plate

Product Description

Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator
Material: Aluminum + Copper
Product Dimension: 88×68×40mm
Product Weight: 0.25 kg
Heat Conducting Power: 105W
Surface Treatment: Passivation
Product Technology: Zipper fin + surface finish
Advanced Chip Cooling Solution
High-integration chips, particularly core business processing units, require simultaneous multi-tasking capabilities with rapid data processing speeds, inevitably generating significant power consumption and heat. Effective thermal transfer is essential to prevent heat accumulation, which can cause sharp temperature increases within the device environment, leading to excessive junction temperatures, component failure, system restarts, crashes, or chip burnout.
Industry standard practice involves installing chip heat sinks on high-heat generating chips, complemented by comprehensive thermal design processing systems. While lightweight heat sinks typically use silica gel or thermal conductive pads for direct attachment, this method is unsuitable for larger heat sinks due to weight considerations that could compromise chip stability and reliability during transport or external vibration.
Our welded foot heat sinks provide secure circuit board mounting through diagonal platform processing with embedded metal welding feet. These feature pre-applied tin coating or tin-coated wire, combined with thermal conductive silicon grease or silica gel application on chip surfaces for optimal thermal performance.
Primary Application Fields
  • 100G/200G pluggable optical modules for data center switches
  • Small optical modules for fronthaul/mid-haul equipment of 5G base stations
  • Low-power optical communication components for edge computing nodes
Manufacturing Capabilities
Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator 0
Advanced Brazing Technology
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Brass / Copper CNC
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Aluminium / Zinc CNC
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Stainless Steel / Steel CNC
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Plastic CNC
Key Applications
Industry Application Details
High Performance Computing (HPC) High-density heat dissipation for supercomputers, data center servers, GPU clusters
High Power Electronics Extreme thermal management of IGBT modules, converters, high-power power supplies
Advanced Medical Imaging MRI, CT scanners requiring high temperature stability and reliability
Industrial Automation High-precision temperature control for robot control and precision machine tools
Aerospace and Military Heat dissipation in extreme environments for airborne radar and satellite communications
High-power Laser Equipment Precision temperature control of industrial and scientific research laser systems
New Energy Vehicles Precision thermal management for electric drive systems and battery modules
Renewable Energy Systems High-power equipment including wind power converters and photovoltaic inverters
Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator 5
Vapor Chamber Soldered Heat Sink - High-Efficiency Cooling Buckle Type Radiator 6
Production Equipment
Our manufacturing facility features comprehensive air-cooled equipment including 10 low-temperature solder reflow ovens, 5 baking ovens, 20 automatic solder dispensing units, 3 automatic solder brushing machines, 50 torque-controlled electric screwdrivers, CCD inspection equipment, fully automatic optical module testing systems, multi-station thermal performance testing equipment, and flatness optical testing instruments.
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Quality Assurance
We maintain rigorous quality standards with advanced testing equipment including Coordinate Measuring Machines, projector instruments, water high pressure testing machines, thermal resistance testing systems, and liquid leakage testing equipment.
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Customer Service
  • Prompt response to all inquiries
  • Competitive pricing with guaranteed quality
  • Efficient production scheduling
  • Optimal transportation solutions
  • Comprehensive technical support
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.
Have you exported goods before and to which regions?
60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.
How many employees do you have?
Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.
Can you provide samples if we agree with the design?
Yes, we provide samples for confirmation before mass production, along with technical drawings if required.
What packing methods do you use?
Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.
Do you provide technical support for product issues?
All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.

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