Common Mode (CM) Uchi Isolated Surge (BIS) protection device is a semiconductor device developed for surge
protection requirements of non-isolated LED drivers. Solution of BIS series connecting with MOVs can meet both
isolation requirements and surge protection requirements. For class I LED devices, isolation requirement of electrical
strength is 1000V+2U (U is rated work Voltage), this means the surge protections solutions should have peak
reverse voltage rated up to 1000V+2U, and thus the residual voltage is very high under 4KV or 6KV 1.2/50us &8/
20us surge waves for both L-PE and N-PE lines. Boarden CM BIS products family can significantly reduce the
residual voltage hence protect the LED driver safe and reliable.
1. Meeting both insolation requirement and surge protection
2.Long life under repetitive surges
4.High Working Voltages
7.TUV Rheinland Certificate: R50442482
Qty per Reel
Maximum Ratings and Thermal Characteristics (TA=25°C unless otherwise noted)
Device Ratings and Specifications (Tamb=25℃)
Product Dimensions (mm)
Common-mode BIS surge circuit optimization
1-1The shunt resistance has two functions.
1. Pressure stabilization: due to the existence of resistance, the voltage at both ends of the BIS cannot be sharply changed, so as to reduce the dv / dt induced by the test line, and effectively avoid the gate trigger;
2. Pressure equalization: in the section less than the action voltage, the equivalent impedance of BIS is far greater than the impedance of MOV. Therefore, in the process of voltage resistance test, the voltage is basically added at both ends of the BIS at the beginning, and then as the leakage current increases, MOV gradually shares the voltage. Increase the resistance of level MΩ (the same magnitude as the impedance of the MOV), then the partial pressure of MOV and BIS will be more balanced, and the test will be more stable. Capacitance only voltage stability without poor equalization, so parallel resistance is recommended as compensation improvement.
3. The larger the Y capacitor of drive L and N to the ground, the greater the interference of the inductance in the stabilizer, and the greater the shadow leads to BIS. It is understood that the current drive internal use of 222Y capacitor is more.102Y capacitor is much smaller than 222Y capacitor.
Patch Resistance (color source):
1-2 Safety regulation resistance
Resistance used for grounding shall meet the IEC / UL 60065 (the new version is IEC / UL 62368-1 2018) standard.
Protocol requirements for a linear DOB:
In addition to the combined resistance on both ends of the BIS, the pressure resistance of the aluminum substrate needs to be evaluated.
Because IC and lamp beads and other devices are mounted on the aluminum substrate, because the BIS conduction will also have the
residual pressure of the device, the poor pressure resistance of the aluminum substrate will be different to the IC or lamp beads will be
damaged when the test common mold surge. Therefore, the withstand pressure of the substrate needs to reach 3000VAC (the insulation layer
should reach 120um-180um). Only the aluminum substrate and BIS cooperate can solve the surge performance.
The above common mode BIS surge scheme is built in theswitch non-isolation, isolation, linear scheme both ends of the BIS need and safety regulation resistance or capacitor or RC circuit three voltage equalization scheme can be, enhance the reliability of voltage resistance. RV1 and RV2 are sensitive according to the test voltage tolerance of each customer, and the recommended voltage range is between 680V and 1300V.
Linear DOB and non-isolated drive suggest an aluminum substrate of 3000 Vac.