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Large Current 60A Slow Blow Fuse , Ceramic Chip Fuse R1032 RoHS Compliant

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Large Current 60A Slow Blow Fuse , Ceramic Chip Fuse R1032 RoHS Compliant

Large Current 60A Slow Blow Fuse , Ceramic Chip Fuse R1032 RoHS Compliant
Large Current 60A Slow Blow Fuse , Ceramic Chip Fuse R1032 RoHS Compliant Large Current 60A Slow Blow Fuse , Ceramic Chip Fuse R1032 RoHS Compliant Large Current 60A Slow Blow Fuse , Ceramic Chip Fuse R1032 RoHS Compliant Large Current 60A Slow Blow Fuse , Ceramic Chip Fuse R1032 RoHS Compliant Large Current 60A Slow Blow Fuse , Ceramic Chip Fuse R1032 RoHS Compliant

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Product Details:

Place of Origin: DONGGUAN,CHINA
Certification: UL,CUL
Model Number: R1032

Payment & Shipping Terms:

Minimum Order Quantity: 10,000PCS
Price: Negotiable
Packaging Details: Tape in reel
Delivery Time: 7 days
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 10,000,000pcs per week
Detailed Product Description
Product Name: Chip Fuse Series: R1032
Dimension: 3.1*10 Rated Voltage: 75V 125V 250V
Agency Approval: UL,cUL Rated Current: 0.05~60A
Operating Temperature: -55°C ~125°C RoHS Compliant: Yes
Halogen Free: Yes Body: Ceramic
Fuse Element: Cu-Ag Alloy Wire Cap: Au Plated Brass Cap
Package: Tape In Reel MOQ: 2000PCS Per Reel
High Light:

slow blow glass fuse

,

mini glass fuses

 

UL Certificated Large Current 60A Max. 75V 125V 250V R1032 Time Lag Chip Fuse

 

 

PDF Specification Datasheet : UL Certificated Large Current 60A Max. 75V 125V 25...

 

 

Overview

 

R1032 series large current time lag chip fuse are ceramic tube/end cap constructions, RoHS
compliant, Halogen Free and lead(Pb) exempts of the requirements of RoHS Directive(2002/95/EC), with U.S.
(UL/CSA) safety agency approvals. Provide board level primary and secondary circuit protection in a wide variety of applications. With excellent inrush current withstanding capability, excellent reliability for thermal and mechanic shock, also have a high reliability and stable solder ability, end caps are available in gold/silver/nickel plated. Small size, rapid fusing, SMT fitness, is a current protection device designed for high-power industrial application. The device is widely applicable to module power supply, server, energy storage management system and other application environments.

 

 

Feature

 

• Time-Lag (Slow-Blow)
• Small size(10.2mm*3.2mm)
• Wide operating temperature range
• RoHS compliant
• Wide range of current rating available
• Low temperature de-rating
• Tape and Reel for automatic placement
• Conflict free metals

 

 

Application

 

• LED lighting
• Notebook PC
• Portable Devices
• Battery devices
• LCD/PDP devices
• Networking devices
• Telecom system
• LCD backlight inverter
• PC server
• Power supply
• Cooling fan system
• White goods
• Storage system
• Game console
• Medical equipment
• Wireless base station
• Digital camera
• Office equipment
• Automotive devices

• Storage system power
• Cooling fan system for PC server
• Voltage regulator module
• Base station power supply
• Voltage regulator module for PC server
• High end servers / Blade computing
• Battery Management System

 

 

Specification

 

Large Current 60A Slow Blow Fuse , Ceramic Chip Fuse R1032 RoHS Compliant 0

 


*: These catalog no. cold resistance and I2t value are pending due to fuse elements shall be customized;
DC Cold Resistance are measured at <10% of rated current in ambient temperature of 25℃;
Typical Pre-arching I2t are calculated at 10*In Current or 8ms;
Min Interrupting Rating: 1.35*In.

 

 

Dimension

 

Large Current 60A Slow Blow Fuse , Ceramic Chip Fuse R1032 RoHS Compliant 1

 

 

Material Details

 

NO. Part number Material
1 End cap Au Plated Brass Cap
2 Body Non-Transparent Square Ceramic Tube
3 Fuse element Cu-Ag Alloy wire

 

 

Operating Characteristics

 

% of Ampere Rating(In) Blowing Time
100% * In 4 hours Min
200% * In 120 sec Max

 

 

Product Characteristics

 

NO. Item Content Standard
1

Product Marking

Brand, Ampere Rating

Marking standards

2

Operating Temperature

-55°C to 125°C

IEC60068-2-1/2

3

Solderability

T=240°C±5°C , t=3sec±0.5sec,

Coverage≥95%

IEC60068-2-1/2

4

Resistance to Soldering Heat

T=240°C±5°C , t=3sec±0.5sec,

Coverage≥95%

MIL-STD-202, Method 208

5

Insulation Resistance (after

Opening)

10,000 ohms minimum

MIL-STD-202, Method 302, Test

Condition A

6

Thermal Shock

5 cycles, -65°C / +125°C, 15

minutes at each extreme

MIL-STD-202, Method 107, Test

Condition B

7

Mechanical Shock

100G’s peak for 6 milliseconds, 3cycles

MIL-STD-202, Method 213, Test I

8

Vibration

0.03”amplitude, 10-55 Hz in 1

min. 2hrs each XYZ=6hrs

MIL-STD-202, Method 201

9

Moisture Resistance

10 cycles

MIL-STD-202, Method 106

10

Salt Spray

5% salt solution, 48hrs

MIL-STD-202, Method 101, Test Condition B

 

Contact Details
Dongguan Uchi Electronics Co.,Ltd.

Contact Person: Anna

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